Analysis of data center 200G QSFP28 DD AOC

DateTime：2018/1/11 0:00:00

With the development of large-scale information system revolution, cloud computing technology has provided a practical technical support for the development of big data, Internet and AI based on its low cost, convenience and extensibility. As the data center is an important infrastructure for carrying cloud computing services, the construction of data centers is also one of the keys to the development of cloud computing. At present, the rapid development of cloud computing has led to the pace of resource integration and development of the global data center. In cloud computing data center, in order to achieve data interaction and resource virtualization, the ratio of horizontal data traffic between resource layer devices is quite high, even accounting for 70% of total traffic. In order to solve the transversal data flow between the resource layer devices, the data center needs to use high port capacity and high interface density network devices. Accordingly, the demand for high speed optical interconnection products is becoming higher and higher in the data center.

The significant advantage of QSFP+AOC active optical cable has made it the focus of data center integrators and equipment dealers. However, how to choose a suitable QSFP+AOC active optical cable supplier when building high density and large capacity data center? We believe that the most important thing is to see the production process strength of the QSFP+AOC active optical cable supplier. The production process of AOC usually includes chip mounting, component preassembly, SMOD assembly, lens assembly, fiber coupling, external encapsulation and so on. The most important of these are chip mount technology and optical fiber coupling process. In the chip mounting process, the mainstream chip mounting technology has COB Technology (on board chip package) and Flip-Chip Technology (flip chip). COB technology is the simplest bare chip mounting technology. Its main advantages are low cost, space saving, relatively mature technology and so on. Compared with COB technology, Flip-Chip technology has more advantages in packaging density and speed, which is the ultimate development direction of chip packaging technology and high density installation. In the optical fiber coupling process, the usual coupling way is to add 45 degree prisms between the laser and the optical fiber to realize the optical fiber coupling, and the operation is very difficult. When the ordinary producers are mass-produced, they are prone to have problems in the machining accuracy and the location control of the components. It can be seen that, to a certain extent, the producer with outstanding technological strength is the guarantee of the quality of the QSFP+AOC active fiber cable.

In the research and development of the active optical fiber cable and other products, the core communication has always been improving, and the key production processes such as chip mounting and fiber coupling are strictly controlled. The 200G QSFP28 Cable AOC product of core communications has used the high-precision coupling and assembly process, has higher stability and lower power consumption, and will help to further develop high-density, high-capacity data center and cloud computing network.

graph one：sinovo telecomb200G QSFP28 DD Cable AOC

graph two：sinovo telecom 100G QSFP28 Cable AOC